Footfall crosses 45,500 at SEMICON India 2024, Exhibitors Showcase Key Product Offerings
SEMICON India 2024 was held at India Expo Mart (IEML), Greater Noida from 11th September to 13th September 2024, with the theme ‘Shaping the Semiconductor Future’. The event was organised by India Semiconductor Mission in partnership with California-headquartered SEMI.
SEMICON India was co-located with Electronica India and Productronica India 2024, and a total of 839 companies participated in these events collectively.
SEMICON India 2024 Inaugurated by PM: “Dream to Have Indian-made Chips in Every Device”
SEMICON India was inaugurated by the Indian PM on 11th September 2024. At the inauguration, Mr. Modi said, “It is our dream to have an Indian-made chip in every device in the world”. The Indian PM also expressed the need to grow the value of India’s electronics sector to USD 500 billion by the end of this decade (by 2030) from the current USD 150 billion. He added, “India’s semiconductor ecosystem is a solution not just for India’s challenges but also for global challenges…India will make semiconductor chips and the finished product too”.
Exhibitors at SEMICON India 2024
Hitachi High-Tech Displays Scanning Electron Microscope for Semiconductors
Hitachi High-Tech participated in SEMICON India 2024 exhibition and showcased its High-Resolution Critical Dimension Scanning Electron Microscope (CD-SEM). CD-SEMs are used to measure the dimensions of patterns which are etched on a semiconductor wafer. Interestingly, Hitachi claims the largest share, that is about 70%, of the global CD-SEM market.
Switzerland’s Evatec Showcases Equipment for Substrate Processing
Evatec AG, a semiconductor equipment manufacturer based in Switzerland, showcased its CLUSTERLINE range of substrate processing platforms at SEMICON India 2024. CLUSTERLINE range features automatic handling, and it can process a wide range of wafer sizes and thicknesses. Evatec’s CLUSTERLINE range comprises three variants, CLUSTERLINE 200, CLUSTERLINE 300, and CLUSTERLINE 600.
Substrate refers to the thin wafer of semiconducting material, such as Silicon, upon which different elements of a semiconductor device are fabricated. Therefore, the substrate forms the foundation of any semiconductor device.
HIGGS BOSON SYSTEMS Presents Semiconductor Fabrication Equipment
Gurugram-based HIGGS BOSON SYSTEMS Pvt. Ltd., an industrial equipment supplier, presented semiconductor fabrication equipment from different manufacturers at SEMICON India 2024. This included amcoss GmbH’s fully automatic single wafer processing AMC series. amcoss’ AMC series offers “…individual solutions for substrate Photo-resist coating, developing, lift-off and cleaning” as per the company. Apart from this HIGGS BOSON SYSTEM also displayed Trymax Semiconductor B.V.’s NEO series, “for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase”, which is used in semiconductor fabrication processes.
Cir-Q-Tech Tako Technologies Showcases Cleanroom Equipment
Karnataka-based Cir-Q-Tech Tako Technologies Pvt. Ltd. showcased its range of products for cleanroom environments. These products included Simco-Ion – 5810i Overhead Blower, Simco-Ion – 5511 Digital Ceiling Emitter, Forbo Colorex EC-ESD Vinyl Flooring, and more. In a cleanroom, overhead blowers and ceiling emitters are required to maintain uniform ionisation to eliminate any electromagnetic interference. Apart from this, cleanrooms require special conductive flooring, and the company’s Forbo Colorex EC-ESD Vinyl Flooring features conductive adhesive between tiles for the same.
Gradiant India Features Water Solutions for Semiconductor Plants
Chennai-headquartered Gradiant India Pvt. Ltd. presented its water solutions for semiconductor plants at SEMICON India 2024. Being water-intensive, semiconductor plants generate a lot of wastewater which may contain several impurities such as Perflouoroalkyl Substances and Polyfluoroalkyl Substances (PFAS). Gradiant India’s stall at the exhibition elaborated wastewater recycling and PFAS removal.
Global Marketing Services Displays TRESKY’s Die Bonder
Bengaluru-based Global Marketing Services (GMS), a semiconductor equipment supplier, showcased Dr. TRESKY AG’s T-5100 PC controlled manual die bonder at SEMICON India 2024. Dr. TRESKY AG is a Swiss company which provides microelectronics assembly solutions. Die bonding is the process of attaching a semiconductor die to a substrate such as a Printed Circuit Board (PCB) or another die. The T-5100 die bonder features a compact design, to the extent that this machine can fit on a lab desk. The device executes die bonding through flip-chip placing ‘to sub-micron accuracy’.
SEMICON India 2024 a Major Milestone for Indian Semiconductor Sector
SEMICON India 2024 comes as a major development for the Indian semiconductor sector. Since the foundation of India Semiconductor Mission in 2021, SEMICON India 2024 is the first major event of its scale, bringing together several semiconductor equipment manufacturers and dealers at a single location. Preceeding editions of the event, namely SEMICON India 2022 and 2023, were conferences which were held in Bengaluru and in Gujarat’s Gandhinagar, respectively.